? semiconductor components industries, llc, 2005 august, 2005 ? rev. 4 1 publication order number: baw56lt1/d baw56lt1 preferred device monolithic dual switching diode common anode features ? pb?free packages are available maximum ratings (each diode) rating symbol value unit reverse voltage v r 70 vdc forward current i f 200 madc peak forward surge current i fm(surge) 500 madc non?repetitive peak forward current t = 1 s (note 3) i fsm 4 a thermal characteristics characteristic symbol max unit total device dissipation fr? 5 board (note 1) t a = 25 c derate above 25 c p d 225 1.8 mw mw/ c thermal resistance, junction?to?ambient r ja 556 c/w total device dissipation alumina substrate, (note 2) t a = 25 c derate above 25 c p d 300 2.4 mw mw/ c thermal resistance, junction?to?ambient r ja 417 c/w junction and storage temperature t j , t stg ?55 to +150 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. fr?5 = 1.0 0.75 0.062 in. 2. alumina = 0.4 0.3 0.024 in. 99.5% alumina. 3. square wave; t j = 25 c. anode 3 cathode 1 2 cathode http://onsemi.com marking diagram device package shipping ? ordering information baw56lt1 sot?23 3000 / tape & reel BAW56LT3 sot?23 10,000 / tape & reel preferred devices are recommended choices for future use and best overall value. ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. 1 a1 m sot?23 (to?236) case 318 style 12 a1 = device code m = date code* = pb?free package (note: microdot may be in either location) *date code orientation and overbar may var y depending upon manufacturing location. baw56lt1g sot?23 (pb?free) 3000 / tape & reel BAW56LT3g sot?23 (pb?free) 10,000 / tape & reel
baw56lt1 http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) (each diode) characteristic symbol min max unit off characteristics reverse breakdown voltage (i (br) = 100 adc) v (br) 70 ? vdc reverse voltage leakage current (v r = 25 vdc, t j = 150 c) (v r = 70 vdc) (v r = 70 vdc, t j = 150 c) i r ? ? ? 30 2.5 50 adc diode capacitance (v r = 0, f = 1.0 mhz) c d ? 2.0 pf forward voltage (i f = 1.0 madc) (i f = 10 madc) (i f = 50 madc) (i f = 150 madc) v f ? ? ? ? 715 855 1000 1250 mvdc reverse recovery time (i f = i r = 10 madc, i r(rec) = 1.0 madc) (figure 1) r l = 100 t rr ? 6.0 ns notes: 1. a 2.0 k variable resistor adjusted for a forward current (i f ) of 10 ma. notes: 2. input pulse is adjusted so i r(peak) is equal to 10 ma. notes: 3. t p ? t rr +10 v 2.0 k 820 0.1 f d.u.t. v r 100 h 0.1 f 50 output pulse generator 50 input sampling oscilloscope t r t p t 10% 90% i f i r t rr t i r(rec) = 1.0 ma output pulse (i f = i r = 10 ma; measured at i r(rec) = 1.0 ma) i f input signal figure 1. recovery time equivalent test circuit
baw56lt1 http://onsemi.com 3 100 0.2 0.4 v f , forward voltage (volts) 0.6 0.8 1.0 1.2 10 1.0 0.1 t a = 85 c 10 0 v r , reverse voltage (volts) 1.0 0.1 0.01 0.001 10 20 30 40 50 1.75 0 v r , reverse voltage (volts) 1.5 1.25 1.0 0.75 c d , diode capacitance (pf) 2468 i f , forward current (ma) figure 2. forward voltage figure 3. leakage current figure 4. capacitance t a = ?40 c t a = 25 c t a = 150 c t a = 125 c t a = 85 c t a = 55 c t a = 25 c i r , reverse current ( a) curves applicable to each cathode
baw56lt1 http://onsemi.com 4 package dimensions sot?23?3 (to?236) case 318?08 issue al style 12: pin 1. cathode 2. cathode 3. anode b c l d a e a1 e 3 1 2 dim a min nom max min millimeters 0.89 1.00 1.11 0.035 inches a1 0.01 0.06 0.10 0.001 b 0.37 0.44 0.50 0.015 c 0.09 0.13 0.18 0.003 d 2.80 2.90 3.04 0.110 e 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 l 0.35 0.54 0.69 0.014 2.10 2.40 2.64 0.083 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318?01 thru ?07 and ?09 obsolete, new standard 318?08. h e 0.040 0.044 0.002 0.004 0.018 0.020 0.005 0.007 0.114 0.120 0.051 0.055 0.075 0.081 0.021 0.029 0.094 0.104 nom max h e mm inches scale 10:1 0.8 0.031 0.9 0.035 0.95 0.037 0.95 0.037 2.0 0.079 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 baw56lt1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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